IBM and 3M developped a computer chip with a super glue that is 1000 times faster than today’s microprocessors.
IBM Corp. and 3M have already succeeded in creating a silicon tower that dissipates heat and allows stacking up to 100 chips on each other. The 3D processor would be 1000 times faster than those that are in our computers today.
The main idea came from the construction of skyscrapers : more people and more work space on the same ground surface.
These new chips could be on the consumer market by 2014. We can already imagine the benefits of this new technology applied to video game consoles, smartphones, tablets and computers (for public AND web servers).